Vol 2 Chapter 316: : Complex chip process (dry goods)

Forty days later, the Microelectronics R & D Center of Huangkeng Reservoir.
In a laboratory, Ye Hua, dressed in dust-free clothes, skillfully touched the floating screen in front of his eyes, and Yu Guang of both eyes glanced at the engineer passing by. The plate film is like a thin pie with dozens of independent microcircuit arrays on it, which means that there are dozens of chips, just like the flat printing process.
Of course, these dozens of chips are all exactly the same type, but the specific CPU or other integrated circuits cannot be seen by the naked eye, depending on its IC design.
The complete process of chip production includes: chip design, chip production, package production, cost testing, and other large links. The small links are not mentioned, as many as 2,000 processes.
For chip manufacturing, the process is the same as building a house. First, a wafer is used as the foundation, and then the chips are layered on top of each other to produce the necessary IC chips.
Before that, it was necessary to have design drawings. Without the ability to make design drawings, it was useless against the sky. Therefore, the role of "architect" is very important.
And this role is played by IC design. The IC design in the CSAC system is not only Hisilicon semiconductor, but almost covers IC design. Subsidiary Xianfeng Nano has led the IC design of the CPU chip, but also the IC design of PHC. In addition, the strongest IC design is HiSilicon, HiSilicon also dominates the IC design of another CPU, that is, the CPU of Huawei mobile phones.
That's right, in the future, Huawei's mobile phone chips will gradually be completely localized, and no longer use silicon wafers, but tin wafers.
In the IC design and production process, planning is carried out by major IC design manufacturers. The current international representatives are Qualcomm and Intel, which are well-known global manufacturers. They all design their own IC chips and provide chips with different specifications and performance to downstream. Vendor selection.
The IC design flow of a single chip includes the design of the hardware description language (HDL), the debug of the chip design, the analysis of the chip design, FPGA verification, and so on.
After the IC design, the chip is manufactured. According to the requirements of the IC design, the chip solution design is generated, and the next step is proofing.
Xianfeng Nano provided the chip raw material wafers. This time, Ye Hua's chip sample components are no longer traditional silicon, but tinene materials have been replaced. The purification is the extreme degree of 9 9 after the 99 decimal point.
The thinner the stannene material, the lower the cost, but the process requirements are also proportional. The purification technology of Shin-Etsu Chemical is still very powerful.
The next step is wafer coating, which is a kind of photoresist made of a material that can resist oxidation and temperature resistance.
The next step is the process that Ye Hua is currently leading in the laboratory: photolithographic development, etching.
In the process of the process, a chemical that is sensitive to ultraviolet light is also provided by Xianfeng Nano, which will soften when exposed to ultraviolet light. The shape of the chip is obtained by controlling the position of the light shield. Dozens of microcircuit arrays on the surface of the "big cake".
At this moment, Ye Hua directs the staff to carry out the photoresist process on the tinene wafer. The part exposed to direct ultraviolet light begins to dissolve. After the completion, the dissolved part is washed away with a solvent. The rest The part is the same as the shape of the shade.
The next step is to add impurities, implant ions into the wafer, and produce the corresponding P and N semiconductors.
Starting from the exposed area on the tin sheet and putting it into the chemical ion mixed liquid, this process is to change the conductivity of the doped area so that each transistor can be turned on, off, or carry data information. A simpler chip is enough for one layer. The complicated one is multiple layers. It is realized by repeating photolithography and repeating the previous process, forming a three-dimensional structure, just like building a house.
However, building a house on a tin sheet can have nanometer-level accuracy and hundreds of millions of scale as a unit of magnitude. Chip manufacturing is worthy of representing the ultimate peak of today's human industrial manufacturing.
The next step is wafer testing. After going through the above processes, grid-like grains are formed on the wafer, and the electrical characteristics of each grain are tested by means of pin testing.
The next step is packaging. The finished wafer is fixed, the pins are bonded, and various packaging forms are produced according to requirements. This is why the core of the same chip can have different packaging forms, mainly based on the user's Application habits, application scenarios, market forms and other peripheral factors determine.
The next step is to test the packaging. After completing the previous process flow, the chip production has been completed. This step is to test the chip, remove defective products and packaging.
Although the entire manufacturing process flow of a chip has been completed here, it is not yet available for the market. Functional tests of the chip must be performed to verify that each function is normal, and then it can be packaged and shipped to the market.
It is simple to say, but there are as many as 2,000 processes in the chip manufacturing process, and no mistakes can be made.
In addition, the cost of the process and equipment for chip production is too high. For example, ASML lithography machines cost more than 100 million US dollars. Even other parts of the entire supply chain, ordinary small companies cannot afford it, or if Once a small error occurs in the process, unknown predictions may lead to the failure of chip production, thereby losing millions or even more huge funds.
The staff assisting Ye Hua in the laboratory are all elites in the high-tech field, and it is still difficult to produce high-quality chips without them.
After PHC was banned globally and Americans banned the sale of chips to the coastline, Ye Hua created the CSAC Club. Basically, members of the system have become PHC's upstream supplier partners, and Hisilicon is also listed.
In addition to providing IC chips for the parent company Huawei mobile phones in the future, Hisilicon will now provide four major IC chips for PHC. One family has eaten the four major IC chips because Hisilicon has more than ten years of history and other CSAC semiconductor members. Without that strength, the supply chain to which one of the IC chips can be divided is very good.
First among them is Hisense's fist product, the 5G communication chip. As the standard leader of 5G networks, Huawei, PHC started with Huawei's 5G standard.
Then there is the Bluetooth chip. The number of this chip is H1309, produced by Hisilicon, and there is also a power management chip H1723, which is also an authentic Hisense produced. In addition to these three chips, there is the last H2482. This chip is PHC audio management chip.
In the future PHC machines on the coastline, these big chips will be provided by Hisilicon. As an upstream supply chain strategic partner, Hisilicon's business can obtain huge revenues of US $ 8-10 billion from PHC every year. It has become a leading semiconductor giant in the world. It must be known that Hisilicon's business department is not just PHC.
Other members of the CSAC system are attached to the upstream supply chain of PHC hardware and supply chips for PHC. Supplier partners in the CSAC system realize how precious a core seat of CSAC is. In the future, I am afraid that many domestic semiconductor companies will be crowded out. The head must enter this system.
As a club's partner or ally ~ EbookFREE.me ~, the patent barriers between members of its internal system have been opened up. For example, when major upstream supply chain partners supply PHC, there is no patent fee, which is indeed much less. Revenue, but supplies outside the system are not included.
In addition, because the entire CSAC is a community of interests, it has opened up internal barriers, which means that the product is cheaper. Compared with chips from Europeans and Americans, it can immediately obtain a huge competitive advantage internationally, one is price advantage, and the other is technological advantage.
Hmm, the rabbits immediately stunned to implement the rhythm of cabbage prices.
This is the lingering pain and tears of Europeans and Americans, because rabbits have a lot of "black history" in this area. As long as the belly black rabbit enters a field, the product in this field will be the price of cabbage.
There was also a joke that said: When Europeans and Americans are preparing to enter a field, they must first see if there are Huaxia people playing there. If there are or Huaxia people are going to play, then bother, no Playing with you, because I ca n’t play, I do n’t make money, how do rabbits play a price war with you?
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